Suffolk Reporter

The U.S. Department of Energy (DOE) has announced a funding allocation of $179 million for the establishment of three Microelectronics Science Research Centers (MSRCs). These centers will focus on advancing research in microelectronics materials, device and system design, and manufacturing science. The initiative aims to transform future microelectronics technologies.

Authorized by the Micro Act under the CHIPS and Science Act of 2022, these MSRCs are part of a broader effort to enhance activities at various government agencies, including the Department of Commerce and the Department of Defense. DOE's long-standing involvement in microelectronics positions it as a leader in fostering scientific understanding that drives technological advancements.

"Advancements in microelectronics are critical to furthering scientific discovery," stated Harriet Kung, Deputy Director for Science Programs at DOE’s Office of Science. "The innovations that come from these research centers will improve our daily lives and drive forward U.S. leadership in science and technology."

One notable project among these initiatives is led by Brookhaven National Laboratory, which will head the Electro-Photonic Integrated Platform for Near-Sensor Processing in Extreme Environments (El-Pho). This project focuses on improving energy efficiency and transmission speeds for data-intensive systems operating under extreme conditions such as cryogenic temperatures and intense magnetic fields.

Brookhaven Lab staff scientist Grzegorz Deptuch leads El-Pho with support from partners across national labs, academia, and industry. The team will develop a research platform aimed at optimizing microelectronics circuits capable of handling large data volumes produced by complex detectors expected to operate at increasing rates.

Three specific MSRCs have been highlighted:

1. The Microelectronics Energy Efficiency Research Center for Advanced Technologies (MEERCAT) seeks to revolutionize energy-efficient microelectronics through integrated innovations spanning materials, devices, modalities, and system architectures.

2. The Co-design and Heterogeneous Integration in Microelectronics for Extreme Environments (CHIME) Center focuses on developing robust electronics solutions capable of thriving in extreme thermal and radiation environments through interdisciplinary co-design efforts.

3. The Extreme Lithography & Materials Innovation Center (ELMIC) aims to advance fundamental science related to new materials integration into future systems, with an emphasis on plasma-based nanofabrication and extreme-scale memory.

These centers comprise networks of projects—16 in total—led by 10 national laboratories. Projects were selected via competitive peer review under the DOE Laboratory Announcement “Microelectronics Science Research Center Projects for Energy Efficiency and Extreme Environments.”